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U.S. Department of Energy
Office of Scientific and Technical Information

High thermal expansion, sealing glass

Patent ·
OSTI ID:869016

A glass composition for hermetically sealing to high thermal expansion materials such as aluminum alloys, stainless steels, copper, and copper/beryllium alloys, which includes between about 10 and about 25 mole percent Na.sub.2 O, between about 10 and about 25 mole percent K.sub.2 O, between about 5 and about 15 mole percent Al.sub.2 O.sub.3, between about 35 and about 50 mole percent P.sub.2 O.sub.5 and between about 5 and about 15 mole percent of one of PbO, BaO, and mixtures thereof. The composition, which may also include between 0 and about 5 mole percent Fe.sub.2 O.sub.3 and between 0 and about 10 mole percent B.sub.2 O.sub.3, has a thermal expansion coefficient in a range of between about 160 and 210.times.10-7/.degree.C. and a dissolution rate in a range of between about 2.times.10.sup.- 7 and 2.times.10.sup.-9 g/cm.sup.2 -min. This composition is suitable to hermetically seal to metallic electrical components which will be subjected to humid environments over an extended period of time.

Research Organization:
AT & T CORP
DOE Contract Number:
AC04-76DP00789
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Number(s):
US 5262364
OSTI ID:
869016
Country of Publication:
United States
Language:
English

References (1)

A structural basis for the corrosion resistance of lead-iron-phosphate glasses: An X-ray absorption spectroscopy study journal September 1988