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U.S. Department of Energy
Office of Scientific and Technical Information

Method for bonding thin film thermocouples to ceramics

Patent ·
OSTI ID:868797

A method is provided for adhering a thin film metal thermocouple to a ceramic substrate used in an environment up to 700 degrees Centigrade, such as at a cylinder of an internal combustion engine. The method includes the steps of: depositing a thin layer of a reactive metal on a clean ceramic substrate; and depositing thin layers of platinum and a platinum-10% rhodium alloy forming the respective legs of the thermocouple on the reactive metal layer. The reactive metal layer serves as a bond coat between the thin noble metal thermocouple layers and the ceramic substrate. The thin layers of noble metal are in the range of 1-4 micrometers thick. Preferably, the ceramic substrate is selected from the group consisting of alumina and partially stabilized zirconia. Preferably, the thin layer of reactive metal is in the range of 0.015-0.030 micrometers (15-30 nanometers) thick. The preferred reactive metal is chromium. Other reactive metals may be titanium or zirconium. The thin layer of reactive metal may be deposited by sputtering in ultra high purity argon in a vacuum of approximately 2 milliTorr (0.3 Pascals).

Research Organization:
NATIONAL BUREAU OF STANDARDS
DOE Contract Number:
AI05-83OR21375
Assignee:
United States of America as represented by United States (Washington, DC)
Patent Number(s):
US 5215597
OSTI ID:
868797
Country of Publication:
United States
Language:
English