Stand-off transmission lines and method for making same
- Livermore, CA
Standoff transmission lines in an integrated circuit structure are formed by etching away or removing the portion of the dielectric layer separating the microstrip metal lines and the ground plane from the regions that are not under the lines. The microstrip lines can be fabricated by a subtractive process of etching a metal layer, an additive process of direct laser writing fine lines followed by plating up the lines or a subtractive/additive process in which a trench is etched over a nucleation layer and the wire is electrolytically deposited. Microstrip lines supported on freestanding posts of dielectric material surrounded by air gaps are produced. The average dielectric constant between the lines and ground plane is reduced, resulting in higher characteristic impedance, less crosstalk between lines, increased signal propagation velocities, and reduced wafer stress.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Regents of University of California (Oakland, CA)
- Patent Number(s):
- US 5017509
- OSTI ID:
- 867827
- Country of Publication:
- United States
- Language:
- English
Similar Records
Thin-film chip-to-substrate interconnect and methods for making same
Thin-film chip-to-substrate interconnect and methods for making same
Related Subjects
additive
additive process
air
air gap
air gaps
average
characteristic
characteristic impedance
circuit
circuit structure
constant
crosstalk
deposited
dielectric
dielectric constant
dielectric layer
dielectric material
direct
direct laser
electrolytically
etched
etching
fabricated
fine
followed
formed
freestanding
gaps
ground
ground plane
impedance
increased
integrated
integrated circuit
laser
laser writing
layer
lines
material
material surround
material surrounded
metal
metal layer
metal line
metal lines
method
microstrip
nucleation
plane
plating
portion
posts
process
produced
propagation
propagation velocities
reduced
regions
removing
resulting
separating
signal
stand-off
standoff
stress
strip line
strip metal
structure
subtractive
supported
surrounded
transmission
transmission line
transmission lines
trench
velocities
wafer
wire
writing