Stand-off transmission lines and method for making same
- Livermore, CA
Standoff transmission lines in an integrated circuit structure are formed by etching away or removing the portion of the dielectric layer separating the microstrip metal lines and the ground plane from the regions that are not under the lines. The microstrip lines can be fabricated by a subtractive process of etching a metal layer, an additive process of direct laser writing fine lines followed by plating up the lines or a subtractive/additive process in which a trench is etched over a nucleation layer and the wire is electrolytically deposited. Microstrip lines supported on freestanding posts of dielectric material surrounded by air gaps are produced. The average dielectric constant between the lines and ground plane is reduced, resulting in higher characteristic impedance, less crosstalk between lines, increased signal propagation velocities, and reduced wafer stress.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Regents of University of California (Oakland, CA)
- Patent Number(s):
- US 5017509
- OSTI ID:
- 867827
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
transmission
lines
method
standoff
integrated
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structure
formed
etching
removing
portion
dielectric
layer
separating
microstrip
metal
ground
plane
regions
fabricated
subtractive
process
additive
direct
laser
writing
fine
followed
plating
trench
etched
nucleation
wire
electrolytically
deposited
supported
freestanding
posts
material
surrounded
air
gaps
produced
average
constant
reduced
resulting
characteristic
impedance
crosstalk
increased
signal
propagation
velocities
wafer
stress
additive process
ground plane
air gap
dielectric constant
transmission lines
dielectric layer
metal layer
transmission line
integrated circuit
dielectric material
characteristic impedance
propagation velocities
metal lines
air gaps
strip line
strip metal
circuit structure
direct laser
material surround
material surrounded
metal line
laser writing
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