Electrical contacts for a thin-film semiconductor device
- Yardley, PA
- Pennington, NJ
- East Brunswick, NJ
A method of fabricating spaced-apart back contacts on a thin film of semiconductor material by forming strips of buffer material on top of the semiconductor material in locations corresponding to the desired dividing lines between back contacts, forming a film of metal substantially covering the semiconductor material and buffer strips, and scribing portions of the metal film overlying the buffer strips with a laser without contacting the underlying semiconductor material to separate the metal layer into a plurality of back contacts. The buffer material serves to protect the underlying semiconductor material from being damaged during the laser scribing. Back contacts and multi-cell photovoltaic modules incorporating such back contacts also are disclosed.
- Assignee:
- Solarex Corporation (Rockville, MD)
- Patent Number(s):
- US 4854974
- Application Number:
- 07/197,433
- OSTI ID:
- 867065
- Country of Publication:
- United States
- Language:
- English
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Electrical contacts for a thin-film semiconductor device
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