Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same

Patent · Tue Feb 14 00:00:00 EST 1984

OSTI ID:864883

Luhman, Thomas ^[1]; Klamut, Carl ^[2]

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1. Seattle, WA
2. East Patchogue, NY

An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.

• Research Organization: Associated Universities, Inc., Upton, NY (United States)
• DOE Contract Number: AC02-76CH00016
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 4431862
• Application Number: 06/358,083
• OSTI ID: 864883
• Country of Publication: United States
• Language: English

Related Subjects

multiwire
conductor
increased
interwire
resistance
mechanical
stability
method
improved
type
mechanically
stabilized
solder
filler
filled
heated
temperature
sufficient
brittle
below
melting
hot
flexed
causing
separate
wires
comprising
increasing
embodiment
eutectic
controlled
amount
removed
subject
particularly
suited
braided
ribbon-type
superconductors
particularly suited
temperature sufficient
mechanical stability
controlled amount
solder filled
multiwire conductor
eutectic temperature
interwire resistance
mechanically stabilized
solder filler
improved multiwire
increased interwire
filled conductor
/174/29/156/228/335/428/505/