Piezoelectric resonator assembly with thin molybdenum mounting clips
Patent
·
OSTI ID:863884
- Pinellas Park, FL
A resonator mounting assembly wherein the resonator blank is mounted agai an essentially planar surface presented by a plurality of peripherally disposed mounting clips and bonded to this surface to provide substantially all the mechanical support for the blank in a direction normal to the major faces of the resonator blank, while being flexible in the directions parallel to said major faces so as to minimize radial stresses on the resonator blank, particularly during thermal cycling of the resonator assembly. The clips are fabricated of a low thermal expansion material, such as molybdenum, which also has considerable yield strength after exposure to processing temperatures; the bonding of the clips to the edges of the resonator blank can be achieved by a polyimide containing electrically conductive particles.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA
- Assignee:
- United States of America as represented by Secretary of Army (Washington, DC)
- Patent Number(s):
- US 4266157
- OSTI ID:
- 863884
- Country of Publication:
- United States
- Language:
- English
Similar Records
Piezoelectric resonator assembly with thin molybdenum mounting clips
Mounting clips for panel installation
Mounting clips for panel installation
Patent
·
1981
·
OSTI ID:7002433
Mounting clips for panel installation
Patent
·
2017
·
OSTI ID:1343740
Mounting clips for panel installation
Patent
·
2017
·
OSTI ID:1369044
Related Subjects
/310/
achieved
assembly
blank
bonded
bonding
clips
conductive
conductive particles
considerable
containing
cycling
direction
direction normal
directions
disposed
edges
electrically
electrically conductive
essentially
essentially planar
expansion
exposure
fabricated
flexible
major
material
mechanical
mechanical support
minimize
molybdenum
mounted
mounting
mounting assembly
mounting clips
normal
parallel
particles
particularly
peripherally
peripherally disposed
piezoelectric
piezoelectric resonator
planar
planar surface
plurality
polyimide
polyimide containing
processing
processing temperature
processing temperatures
provide
provide substantially
radial
resonator
resonator assembly
strength
stresses
substantially
support
surface
temperatures
thermal
thermal cycling
thermal expansion
yield
yield strength
achieved
assembly
blank
bonded
bonding
clips
conductive
conductive particles
considerable
containing
cycling
direction
direction normal
directions
disposed
edges
electrically
electrically conductive
essentially
essentially planar
expansion
exposure
fabricated
flexible
major
material
mechanical
mechanical support
minimize
molybdenum
mounted
mounting
mounting assembly
mounting clips
normal
parallel
particles
particularly
peripherally
peripherally disposed
piezoelectric
piezoelectric resonator
planar
planar surface
plurality
polyimide
polyimide containing
processing
processing temperature
processing temperatures
provide
provide substantially
radial
resonator
resonator assembly
strength
stresses
substantially
support
surface
temperatures
thermal
thermal cycling
thermal expansion
yield
yield strength