Method for conducting electroless metal-plating processes

Patent · Sun Jan 01 00:00:00 EST 1978

OSTI ID:863222

Petit, George S ^[1]; Wright, Ralph R ^[1]

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1. Oak Ridge, TN

This invention is an improved method for conducting electroless metal-plating processes in a metal tank which is exposed to the plating bath. The invention solves a problem commonly encountered in such processes: how to determine when it is advisable to shutdown the process in order to clean and/or re-passivate the tank. The new method comprises contacting the bath with a current-conducting, non-catalytic probe and, during plating operations, monitoring the gradually changing difference in electropotential between the probe and tank. It has been found that the value of this voltage is indicative of the extent to which nickel-bearing decomposition products accumulate on the tank. By utilizing the voltage to determine when shutdown for cleaning is advisable, the operator can avoid premature shutdown and at the same time avoid prolonging operations to the point that spontaneous decomposition occurs.

• Research Organization: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
• DOE Contract Number: W-7405-ENG-26
• Assignee: United States of America as represented by United States (Washington, DC)
• Patent Number(s): US 4125642
• OSTI ID: 863222
• Country of Publication: United States
• Language: English

Related Subjects

method
conducting
electroless
metal-plating
processes
improved
metal
tank
exposed
plating
bath
solves
commonly
encountered
determine
advisable
shutdown
process
clean
re-passivate
comprises
contacting
current-conducting
non-catalytic
probe
operations
monitoring
gradually
changing
difference
electropotential
found
value
voltage
indicative
extent
nickel-bearing
decomposition
products
accumulate
utilizing
cleaning
operator
avoid
premature
time
prolonging
spontaneous
occurs
decomposition products
comprises contacting
method comprises
improved method
plating bath
method comprise
commonly encountered
electroless metal
metal-plating processes
electroless metal-plating
plating process
conducting electroless
/427/134/204/