An electromagnetic micro=undulator
- ANL
Microfabrication technology using the LIGA (a German acronym for Lithography, Electroforming, and Molding) process offers an attractive alternative for fabricating precision devices with micron-sized features. One such device is a mm-sized micro-undulator with potential applications in a table-top synchrotron light source for medical and other industrial uses. The undulator consists of a silver conductor embedded in poles and substrate of nickel-iron. Electromagnetic modeling of the undulator is done using the eddy current computer code ELEKTRA. Computations predict a field pattern of appropriate strength and quality if the current can be prevented from being shunted from silver by the nickel-iron poles either through insulation or through slotted poles. The design of the undulator along with the computational results are discussed.
- Research Organization:
- Argonne National Lab., Argonne, IL (US)
- Sponsoring Organization:
- USDOE Office of Energy Research (ER) (US)
- DOE Contract Number:
- W-31109-ENG-38
- OSTI ID:
- 834562
- Report Number(s):
- ANL/ASD/CP-92269A
- Country of Publication:
- United States
- Language:
- English
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