Solid state intermetallic compound growth between copper and high temperature, tin-rich solders. Part I. Experimental analysis
- Sandia National Lab., Albuquerque, NM (United States)
An experimental study was performed which examined the solid state growth kinetics of the interfacial intermetallic compound layers formed between copper and the high temperature, tin-rich solders 96.5Sn-3.5Ag (wt.%) and 95Sn-5Sb. These results were compared with baseline data from the 100Sn/copper system. Both the 96.5Sn-3.5Ag and 95Sn-5Sb solders exhibited the individual Cu{sub 3}Sn and Cu{sub 6}Sn{sub 5} layers at the interface; the thickness of the Cu{sub 3}Sn layer being a function of the aging time and temperature. The total thickness of the intermetallic compound layer formed in the 96.5Sn-3.5Ag solder/copper couple showed a mixture of linear and {radical}t dependencies at the lower temperatures of 70, 100, and 135{degree}C, and a t{sup 0.42} dependence at 170 and 205{degree}C. The combined apparent activation energy was 59 kJ/mol; the Arrhenius plot showed a knee between the low and high temperature data. The total layer thickness of the 95Sn-5Sb/copper system exhibited {radical}t dependence at the three lower temperatures and t{sup 0.42} growth kinetics at 170 and 205{degree}C. The combined apparent activation energy was 61 kJ/mol. 7 refs., 7 figs., 3 tabs.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 81364
- Report Number(s):
- CONF-940204-; ISSN 0361-5235; TRN: 95:005154-001
- Journal Information:
- Journal of Electronic Materials, Vol. 23, Issue 8; Conference: 123. annual meeting of the Minerals, Metals and Materials Society, San Francisco, CA (United States), 27 Feb - 3 Mar 1994; Other Information: PBD: Aug 1994
- Country of Publication:
- United States
- Language:
- English
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