On the thermally-induced residual stresses in thick fiber-thermoplastic matrix (PEEK) cross-ply laminated plates
Conference
·
OSTI ID:79544
An analytical method for calculating thermally-induced residual stresses in laminated plates is applied to cross-ply PEEK laminates. The authors considered three cooling procedures: slow cooling (uniform temperature distribution); convective and radiative cooling; and rapid cooling by quenching (constant surface temperature). Some of the calculated stresses are of sufficient magnitude to effect failure properties such as matrix microcracking.
- Research Organization:
- Federal Aviation Administration, Washington, DC (United States)
- OSTI ID:
- 79544
- Report Number(s):
- N--95-28266; NASA-CR--198718; NAS--1.26:198718; DOT/FAA/CT--92-25-VOL-3; CONF-9111350--; CNN: NAS1-18833
- Country of Publication:
- United States
- Language:
- English
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