Formation and growth of antiphase domains during recrystallization of cold-rolled Cu{sub 3}Au
- Univ. of Cambridge (United Kingdom). Dept. of Materials Science and Metallurgy
An experimental study by TEM was made of the morphology of the antiphase domains formed when heavily rolled Cu{sub 3}Au is annealed at a temperature slightly below the critical temperature for ordering, {Tc}. Domains are formed at the advancing grain boundary with extremely small size and grow as recrystallization proceeds. From an early stage, domain walls show a preference for (100) orientation. The key question is raised whether domain formation during recrystallization entails the presence of a disordered zone at a moving grain boundary near {Tc}, and the conclusion is that such a zone is probably present. A provisional theory is constructed for the genesis of domains during recrystallization, taking into account the dragging force which newly formed domains exert on a moving grain boundary thereby diminishing the effective driving force for grain boundary motion, and a critical domain size is estimated which should completely inhibit grain-boundary motion. The intriguing fact that no domains at all are formed during the recrystallization of strongly ordered intermetallics such as Ni{sub 3}Al is briefly discussed and a reason is proposed.
- OSTI ID:
- 78304
- Report Number(s):
- CONF-941144-; ISBN 1-55899-265-0; TRN: IM9531%%355
- Resource Relation:
- Conference: Fall meeting of the Materials Research Society (MRS), Boston, MA (United States), 28 Nov - 9 Dec 1994; Other Information: PBD: 1995; Related Information: Is Part Of High-temperature ordered intermetallic alloys VI: Part 1. Materials Research Society symposium proceedings Volume 364; Horton, J. [ed.] [Oak Ridge National Lab., Oak Ridge, TN (United States)]; Baker, I. [ed.] [Dartmouth College, Hanover, NH (United States)]; Hanada, Shuji [ed.] [Tohoku Univ., Sendai (Japan)]; Noebe, R.D. [ed.] [NASA Lewis Research Center, Cleveland, OH (United States)]; Schwartz, D.S. [ed.] [McDonnell Douglas Aerospace, St. Louis, MO (United States)]; PB: 713 p.
- Country of Publication:
- United States
- Language:
- English
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