Post-Processed Integrated Microsystems
- Sandia National Laboratories
No abstract prepared.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 780289
- Report Number(s):
- SAND2001-0227
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
42 ENGINEERING
ADVANCED PACKAGING
CHEMIRESISTOR
DEEP REACTIVE ION ETCHING (DRIE)
DESIGN
ETCHING
FABRICATION
FLEXURAL PLATE WAVE (FPW)
INTEGRATED MICROSYSTEMS
MICRO-OPTOELECTROMECHANICAL SYSTEMS (MOEMS)
MICROELECTROMECHANICAL SYSTEMS (MEMS)
MICROELECTRONIC CIRCUITS
MICROSYSTEMS
MINIATURIZATION
MONITORS
PACKAGING
SENSORS
SURFACE ACOUSTIC WAVE (SAW)
ADVANCED PACKAGING
CHEMIRESISTOR
DEEP REACTIVE ION ETCHING (DRIE)
DESIGN
ETCHING
FABRICATION
FLEXURAL PLATE WAVE (FPW)
INTEGRATED MICROSYSTEMS
MICRO-OPTOELECTROMECHANICAL SYSTEMS (MOEMS)
MICROELECTROMECHANICAL SYSTEMS (MEMS)
MICROELECTRONIC CIRCUITS
MICROSYSTEMS
MINIATURIZATION
MONITORS
PACKAGING
SENSORS
SURFACE ACOUSTIC WAVE (SAW)