Effect of Glue Layers on Response of Cellulose Fiberboard at Low Temperature

Conference · Wed Mar 07 04:00:00 EST 2001

OSTI ID:775674

Smith, A C

Studies of crush performance of cane fiberboard assemblies, sometimes used in overpacks for radioactive materials packages, has shown that, under low temperature or desiccated conditions, a short duration transient stress spike may occur for specimens loaded parallel to the plane of the fiberboard. This effect has been attributed to the stiffening effect of the layers of glue bonding the fiberboard sheets together. The question of the possibility of a property of the fiberboard itself being responsible for this phenomenon has been raised. To answer this question, specimens of fiberboard were bonded with varying amounts of glue and the resulting joint evaluated. Microscopic analysis was performed of the Celotex(R) and glue layer in these specimens and in specimens cut from production packages. Available test results indicate that the Celotex(R) is essentially isotropic. No indication of cellulose properties which could account for the spike phenomenon was found. The study revealed that the glue layer is in the form of islands of glue, formed in pores on the fiberboard surface, connected by thin ligaments of glue.

• Research Organization: Savannah River Site (US)
• Sponsoring Organization: US Department of Energy (US)
• DOE Contract Number: AC09-96SR18500
• OSTI ID: 775674
• Report Number(s): WSRC-TR-2001-00083
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
42 ENGINEERING
ADHESIVES
BONDING
CELLULOSE
COMPOSITE MATERIALS
COMPRESSION STRENGTH
FIBERS
MORPHOLOGY
PACKAGING
PERFORMANCE
RADIOACTIVE MATERIALS