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Title: Ultra-Lightweight Carbon-Carbon Cooling Structures for Pixel and Silicon Strip Detectors

Technical Report ·
OSTI ID:773380

Sandwich-like structures constructed entirely from carbon-carbon materials have been constructed and tested for thermal and stability performance. Performance of the ultra-lightweight thermostructures benefited from the high thermal conductivity, low coefficient of thermal expansion, and zero moisture sensitivity of the carbon-carbon materials. An array of 12 sectors mounted on a specially designed composite ring successfully completed thermal stability testing.

Research Organization:
HYTEC, Inc.
Sponsoring Organization:
USDOE Office of Chief Financial Officer (CR); USDOE Office of Science (SC)
DOE Contract Number:
FG03-97ER82397
OSTI ID:
773380
Report Number(s):
HYTEC-TN-DOE/SBIR-05; TRN: US201208%%835
Country of Publication:
United States
Language:
English