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A New Fabrication Process for Thin-Film Multijunction Thermal Converters

Journal Article · · IEEE Transactions on Instrumentation and Measurment (CPEM Special Issue)

Advanced thin film processing and packaging technologies are employed in the fabrication of new planar thin-film multifunction thermal converters. The processing, packaging, and design features build on experience gained from prior NIST demonstrations of thin-film converters and are optimized for improved sensitivity, bandwidth, manufacturability, and reliability.

Research Organization:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
AC04-94AL85000
OSTI ID:
771509
Report Number(s):
SAND2000-0758J
Journal Information:
IEEE Transactions on Instrumentation and Measurment (CPEM Special Issue), Journal Name: IEEE Transactions on Instrumentation and Measurment (CPEM Special Issue)
Country of Publication:
United States
Language:
English

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