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Enhanced Measurement of Residual Stress by Speckle Correlation Interferometry and Local Heat Treating for Low Stress Levels

Conference ·
OSTI ID:767283
The measurement of residual stresses by laser annealing and electronic speckle pattern interferometry has been successful for moderate to high stress levels. However, for lower stress levels, say less than eighty percent of yield; sub-micrometer deformations are encountered that result in sub-fringe interferograms. Sub-fringe measurements are not a serious problem with modern optical procedures such as phase shifting interferometry.
Research Organization:
Savannah River Site (US)
Sponsoring Organization:
US Department of Energy (US)
DOE Contract Number:
AC09-96SR18500
OSTI ID:
767283
Report Number(s):
WSRC-MS-2000-00771
Country of Publication:
United States
Language:
English

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