Twenty years of service at NBNM - Analysis of Spectrolab module
- Sandia National Laboratories
This study of adhesional strength and surface analysis of encapsulant and silicon cell samples from a Natural Bridges National Monument (NBNM) Spectrolab module is an attempt to understand from its success. The module was fabricated using polyvinyl butyral (PVB) as an encapsulant. The average adhesional shear strength of the encapsulant at the cell/encapsulant interface in this module was 4.51 MPa or {approximately} 18% lower than that in currently manufactured modules. Typical encapsulant surface composition was as follows: C 75.0 at.% O 23.2 at.%, and Si 1.6 at.%, with Ag {approximately}0.2 at.% and Pb {approximately} 0.5 at.% with some tin respectively over the grid lines and solder bond. Representative silicon cell surface composition was: K 1.4 at.%, C 20.8 at.%, Sn 0.94 at.%, O 15.1 at.%, Na 2.7 at.% and Si 59.0 at.%. The presence of tin detected on the silicon cell surface may be attributed to corrosion of solder bond. The module differs from typical contemporary modules in the use of PVB, metallic mesh type interconnection, and silicon oxide AR coating.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
- Sponsoring Organization:
- US Department of Energy (US)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 755636
- Report Number(s):
- SAND2000-0905C
- Country of Publication:
- United States
- Language:
- English
Similar Records
Use of Melt Flow Rate Test in Reliability Study of Thermoplastic Encapsulation Materials in Photovoltaic Modules
Sandia concentrator array testing experiences