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Title: MEMS Packaging - Current Issues and Approaches

Abstract

The assembly and packaging of MEMS (Microelectromechanical Systems) devices raise a number of issues over and above those normally associated with the assembly of standard microelectronic circuits. MEMS components include a variety of sensors, microengines, optical components, and other devices. They often have exposed mechanical structures which during assembly require particulate control, space in the package, non-contact handling procedures, low-stress die attach, precision die placement, unique process schedules, hermetic sealing in controlled environments (including vacuum), and other special constraints. These constraints force changes in the techniques used to separate die on a wafer, in the types of packages which can be used in the assembly processes and materials, and in the sealing environment and process. This paper discusses a number of these issues and provides information on approaches being taken or proposed to address them.

Authors:
; ;
Publication Date:
Research Org.:
Sandia National Lab. (SNL-NM), Albuquerque, NM (United States); Sandia National Lab. (SNL-CA), Livermore, CA (United States)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
750319
Report Number(s):
SAND99-2814C
TRN: US200221%%290
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: International Conference and Exhibition on High Density Interconnect and Systems Packaging, Denver, CO (US), 04/26/2000--04/28/2000; Other Information: PBD: 19 Jan 2000
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; MECHANICAL STRUCTURES; MICROELECTRONIC CIRCUITS; PACKAGING; MINIATURIZATION; REMOTE HANDLING

Citation Formats

DRESSENDORFER, PAUL V, PETERSON, DAVID W, and REBER, CATHLEEN ANN. MEMS Packaging - Current Issues and Approaches. United States: N. p., 2000. Web.
DRESSENDORFER, PAUL V, PETERSON, DAVID W, & REBER, CATHLEEN ANN. MEMS Packaging - Current Issues and Approaches. United States.
DRESSENDORFER, PAUL V, PETERSON, DAVID W, and REBER, CATHLEEN ANN. 2000. "MEMS Packaging - Current Issues and Approaches". United States. https://www.osti.gov/servlets/purl/750319.
@article{osti_750319,
title = {MEMS Packaging - Current Issues and Approaches},
author = {DRESSENDORFER, PAUL V and PETERSON, DAVID W and REBER, CATHLEEN ANN},
abstractNote = {The assembly and packaging of MEMS (Microelectromechanical Systems) devices raise a number of issues over and above those normally associated with the assembly of standard microelectronic circuits. MEMS components include a variety of sensors, microengines, optical components, and other devices. They often have exposed mechanical structures which during assembly require particulate control, space in the package, non-contact handling procedures, low-stress die attach, precision die placement, unique process schedules, hermetic sealing in controlled environments (including vacuum), and other special constraints. These constraints force changes in the techniques used to separate die on a wafer, in the types of packages which can be used in the assembly processes and materials, and in the sealing environment and process. This paper discusses a number of these issues and provides information on approaches being taken or proposed to address them.},
doi = {},
url = {https://www.osti.gov/biblio/750319}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2000},
month = {1}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

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