Concurrent solid state diffusion bonding and superplastic forming of aluminum alloy 7475

Technical Report · Sun Jan 01 04:00:00 EST 1995

DOI:https://doi.org/10.2172/74169· OSTI ID:74169

Sunwoo, A; Lum, R; Vandervoort, R

Earlier studies on diffusion bonding (DB) of Al alloys have focused mostly in extrinsically changing the bonding conditions through the use of interlayers, surface etching, or environment. The problem with focusing on the extrinsic conditions only is that the benefits of the DB process are not fully utilized and instead, it can create problems for the base alloy. The approach we have taken to study solid state diffusion bondability of Al alloy is to utilize the intrinsic behavior of superplastic material. Beginning with this preprocessed material, we used a unique method, to obtain diffusion bonding concurrently with superplastic forming to achieve ductile, oxide-free bonds at significantly lower pressures and temperature in an argon atmosphere.

• Research Organization: Lawrence Livermore National Lab., CA (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: W-7405-ENG-48
• OSTI ID: 74169
• Report Number(s): UCRL-ID--119335; ON: DE95013290
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM BASE ALLOYS
BONDING
DIFFUSION
GRAIN SIZE
MECHANICAL PROPERTIES
MICROSTRUCTURE