High temperature syntactic foam

Technical Report · Fri Jul 01 00:00:00 EDT 1977

DOI:https://doi.org/10.2172/7317026· OSTI ID:7317026

McIlroy, H M

Resins from the polyimide, polybenzimidazole polyamide-imide, phenolic, silicone, and urethane families were formulated with glass microbubbles and carbon microspheres to produce low density, high strength syntactic foams. The polyimide and polybenzimidazole foams were the most thermally stable, but even the urethane exceeded the design goals. Foams with high and low thermal conductivity were developed and their material properties were measured. The low conductivity was achieved using glass microbubble fillers and high conductivity was achieved using carbon microsphere fillers.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: EY-76-C-04-0613
• OSTI ID: 7317026
• Report Number(s): BDX-613-1534(Rev.)
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360601* -- Other Materials-- Preparation & Manufacture
360603 -- Materials-- Properties
BUBBLES
CARBAMATES
CARBON
CARBONIC ACID DERIVATIVES
CARBOXYLIC ACID SALTS
COLLOIDS
DISPERSIONS
ELEMENTS
FABRICATION
FOAMS
GLASS
MECHANICAL PROPERTIES
MICROSPHERES
NONMETALS
ORGANIC COMPOUNDS
ORGANIC NITROGEN COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
PHYSICAL PROPERTIES
POLYMERS
RESINS
THERMAL CONDUCTIVITY
THERMODYNAMIC PROPERTIES
URETHANE