Creep and creep rupture of an advanced silicon nitride ceramic

Journal Article · Fri Apr 01 04:00:00 EST 1994 · Journal of the American Ceramic Society; (United States)

DOI:https://doi.org/10.1111/j.1151-2916.1994.tb07241.x· OSTI ID:7303158

Ding, J L; Liu, K C; More, K L; Brinkman, C R ^[1]

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1. Oak Ridge National Lab., TN (United States). Metals and Ceramics Division

Creep and creep rupture behavior of an advanced silicon nitride ceramic were systematically characterized in the temperature range 1,150 to 1,300 C using uniaxial tensile creep tests. Absence of tertiary creep and the order-of-magnitude breaks in both creep rate and rupture lifetime at certain threshold combinations of stress and temperature were tow characteristic features of the creep behavior observed. Thermal annealing was found to have enhanced both subsequent creep resistance and creep rupture life. The stress exponent (n) and the activation energy (Q) defined in the Norton relation were found to be 12.6 and 1645 kJ/mol for the material investigated. Both values appear to fall in the general range of those reported for other but similar types of Si[sub 3]N[sub 4] ceramic materials. The stress exponent, m, equivalent to the slope of the Larson-Miller equation was found to be in the range 13 to 14.4, and that defined as p in the Monkman-Grant relation to be 0.91, based on the available experimental data. The values of m, n, and p obtained above approximately support the interrelationship of the three exponents given by p = m/n.

• DOE Contract Number: AC05-84OR21400
• OSTI ID: 7303158
• Journal Information: Journal of the American Ceramic Society; (United States), Journal Name: Journal of the American Ceramic Society; (United States) Vol. 77:4; ISSN 0002-7820; ISSN JACTAW
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360203* -- Ceramics
Cermets
& Refractories-- Mechanical Properties
COHERENT SCATTERING
CREEP
DATA
DIFFRACTION
ELECTRON MICROSCOPY
EXPERIMENTAL DATA
FAILURES
HEAT RESISTANT MATERIALS
INFORMATION
MATERIALS
MATERIALS TESTING
MECHANICAL PROPERTIES
MECHANICAL TESTS
MICROSCOPY
MICROSTRUCTURE
NITRIDES
NITROGEN COMPOUNDS
NUMERICAL DATA
PNICTIDES
RUPTURES
SCANNING ELECTRON MICROSCOPY
SCATTERING
SILICON COMPOUNDS
SILICON NITRIDES
TEMPERATURE RANGE
TEMPERATURE RANGE 1000-4000 K
TESTING
X-RAY DIFFRACTION