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Thermal-expansion mismatch and intergrowth types in the system La sub 2-y Nd sub y CuO sub 4

Journal Article · · Journal of Solid State Chemistry; (United States)
;  [1]
  1. Univ. of Texas, Austin (United States)

Stabilization of intergrowth structures of the copper-oxide superconductors requires bond-length matching across the intergrowth interface. The influence of thermal-expansion mismatch on the stabilization of T/O vs T{prime} intergrowths in the La{sub 2-y}Nd{sub y}CuO{sub 4} system is demonstrated by firing the coprecipitated hydroxides/carbonates at 500-1050C. A larger thermal expansion for the (LaNd)-O bond compared to that for the Cu-O bond shifts the T/O-T{prime} phase boundary to a higher y value in La{sub 2-y}Nd{sub y}CuO{sub 4} as the synthesis temperature is increased. Above 950C, an equilibrium phase diagram is obtained with a new line phase T{double prime} appearing at y=0.5. The T{double prime} phase appears to be an ordered variant of the T{prime} phase and could be doped neither n-type nor p-type.

OSTI ID:
7294069
Journal Information:
Journal of Solid State Chemistry; (United States), Journal Name: Journal of Solid State Chemistry; (United States) Vol. 92:1; ISSN 0022-4596; ISSN JSSCB
Country of Publication:
United States
Language:
English