Heat pipe system
Patent
·
OSTI ID:7286690
A heat pipe diode device for transferring heat from a heat source component to a heat sink wall is described. It contains a heat pipe body member attached to the best source; the heat source having a wall forming at least a portion of the normal evaporator section of the heat pipe diode; a working fluid within the body member; a cover for the heat pipe diode forming at least a portion of the heat sink wall; the cover forming the normal condenser for the heat pipe diode; a wick connected between the condenser and the evaporator of the heat pipe diode; means for retaining the wick adjacent the heat pipe wall; a wick support plate adjacent to the cover; the wick being attached to the support plate; means for holding the wick in contact with the cover; and means, responsive to excessive temperatures at the heat sink wall, for moving the support plate and a portion of the wick away from the cover to thereby substantially reduce heat flow in the reverse direction through said heat pipe diode device.
- Assignee:
- Secretary of the Air Force
- Patent Number(s):
- None
- OSTI ID:
- 7286690
- Country of Publication:
- United States
- Language:
- English
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