Predicting Microstructural-Level Residual Stresses and Crack Paths in Ceramics
Conference
·
OSTI ID:7262
- Sandia National Laboratories
Microstructural-level residual stresses arise in ceramics due to thermal expansion anisotropy. The magnitude of these stresses can be very high and may cause spontaneous microcracking during the processing of these materials. The orientation data obtained by backscattered electron diffraction and grain boundary energies obtained by AFM were used in conjunction with an object oriented finite element analysis package (OOF) to predict the magnitude of residual stresses in alumina. Crack initiation and propagation were also simulated based on the Griffith fracture criterion.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 7262
- Report Number(s):
- SAND99-1276C; ON: DE00007262
- Country of Publication:
- United States
- Language:
- English
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