Solder for oxide layer-building metals and alloys
A low temperature solder and method for soldering an oxide layer-building metal such as aluminum, titanium, tantalum or stainless steel is disclosed. The composition comprises tin and zinc; germanium as a wetting agent; preferably small amounts of copper and antimony; and a grit, such as silicon carbide. The grit abrades any oxide layer formed on the surface of the metal as the germanium penetrates beneath and loosens the oxide layer to provide good metal-to-metal contact. The germanium comprises less than approximately 10% by weight of the solder composition so that it provides sufficient wetting action but does not result in a melting temperature above approximately 300 C. The method comprises the steps rubbing the solder against the metal surface so the grit in the solder abrades the surface while heating the surface until the solder begins to melt and the germanium penetrates the oxide layer, then brushing aside any oxide layer loosened by the solder.
- DOE Contract Number:
- AC09-89SR18035
- Assignee:
- PTO; EDB-94-088860
- Patent Number(s):
- US 5147471; A
- Application Number:
- PPN: US 7-681290
- OSTI ID:
- 7233769
- Resource Relation:
- Patent File Date: 8 Apr 1991
- Country of Publication:
- United States
- Language:
- English
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Solder for oxide layer-building metals and alloys
Solder for oxide layer-building metals and alloys