Alternate capacitor dielectric film materials
Technical Report
·
OSTI ID:720762
New high-temperature, high-energy density, and high-radiation tolerant capacitor applications require the evaluation of alternate dielectric materials. Evaluation work was performed at GE Neutron Devices (GEND) and Sandia National Laboratories (SNL), Albuquerque. US Department of Energy (DOE) requirements for capacitor function and environments are unique, and the representations included in this report do not constitute an endorsement of any material or manufacturer. This report presents data on polymeric dielectric films evaluated to support the design of new high-energy density capacitors. Materials which were evaluated include polycarbonate (two sources), polyphenylene sulfide, polyvinylidene fluoride, polyetherimide (three sources), polyimide (four sources), polyethersulfone, and polyetherether ketone. A polyester was evaluated as the control material since many prior designs utilized this dielectric. The film evaluations were based on dielectric constant and dissipation factor variation as a function of temperature ({minus}55{degree}C to 300{degree}C) as well as dielectric breakdown strength. Additionally, film/foil capacitors in a dry wrap-and-fill configuration were fabricated and tested to determine insulation resistance, breakdown voltage, and radiation hardness. Results are given for all evaluations. 7 refs., 4 figs., 4 tabs.
- Research Organization:
- General Electric Co., Largo, FL (United States). Neutron Devices Dept.
- DOE Contract Number:
- AC04-76DP00656
- OSTI ID:
- 720762
- Report Number(s):
- GEPP-TM--1235; ON: TI90021293
- Country of Publication:
- United States
- Language:
- English
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