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Title: Morphology in electrochemically grown conducting polymer films

Abstract

A conducting polymer film with an improved space filling is formed on a metal electrode surface. A self-assembling monolayer is formed directly on the metal surface where the monolayer has a first functional group that binds to the metal surface and a second chemical group that forms a chemical bonding site for molecules forming the conducting polymer. The conducting polymer is then conventionally deposited by electrochemical deposition. In one example, a conducting film of polyaniline is formed on a gold electrode surface with an intermediate monolayer of p-aminothiophenol. 2 figs.

Inventors:
; ;
Publication Date:
OSTI Identifier:
7207456
Patent Number(s):
US 5108573; A
Application Number:
PPN: US 7-533551
Assignee:
Dept. of Energy, Washington, DC (United States) PTO; EDB-94-082075
DOE Contract Number:
W-7405-ENG-36
Resource Type:
Patent
Resource Relation:
Patent File Date: 5 Jun 1990
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; POLYMERS; ELECTROCHEMICAL COATING; MORPHOLOGY; ANILINE; ELECTRIC CONDUCTIVITY; ELECTRIC CONDUCTORS; ELECTRODES; LAYERS; AMINES; AROMATICS; CHEMICAL COATING; DEPOSITION; ELECTRICAL PROPERTIES; ORGANIC COMPOUNDS; PHYSICAL PROPERTIES; SURFACE COATING; 360601* - Other Materials- Preparation & Manufacture; 360602 - Other Materials- Structure & Phase Studies

Citation Formats

Rubinstein, I., Gottesfeld, S., and Sabatani, E. Morphology in electrochemically grown conducting polymer films. United States: N. p., 1992. Web.
Rubinstein, I., Gottesfeld, S., & Sabatani, E. Morphology in electrochemically grown conducting polymer films. United States.
Rubinstein, I., Gottesfeld, S., and Sabatani, E. 1992. "Morphology in electrochemically grown conducting polymer films". United States. doi:.
@article{osti_7207456,
title = {Morphology in electrochemically grown conducting polymer films},
author = {Rubinstein, I. and Gottesfeld, S. and Sabatani, E.},
abstractNote = {A conducting polymer film with an improved space filling is formed on a metal electrode surface. A self-assembling monolayer is formed directly on the metal surface where the monolayer has a first functional group that binds to the metal surface and a second chemical group that forms a chemical bonding site for molecules forming the conducting polymer. The conducting polymer is then conventionally deposited by electrochemical deposition. In one example, a conducting film of polyaniline is formed on a gold electrode surface with an intermediate monolayer of p-aminothiophenol. 2 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = 1992,
month = 4
}
  • A conducting polymer film with an improved space filling is formed on a metal electrode surface. A self-assembling monolayer is formed directly on the metal surface where the monolayer has a first functional group that binds to the metal surface and a second chemical group that forms a chemical bonding site for molecules forming the conducting polymer. The conducting polymer is then conventioonally deposited by electrochemical deposition. In one example, a conducting film of polyaniline is formed on a gold electrode surface with an intermediate monolayer of p-aminothiophenol.
  • A conducting polymer film with an improved space filling is formed on a metal electrode surface. A self-assembling monolayer is formed directly on the metal surface where the monolayer has a first functional group that binds to the metal surface and a second chemical group that forms a chemical bonding site for molecules forming the conducting polymer. The conducting polymer is then conventionally deposited by electrochemical deposition. In one example, a conducting film of polyaniline is formed on a gold electrode surface with an intermediate monolayer of p-aminothiophenol.
  • The authors report in this communication on a significant increase in the density of an electrochemically grown conducting polymer film obtained by preadsorbing a self-assembling monolayer onto the surface of the electrode substrate. Further work in progress addresses questions of the preservation of the effect of this surface treatment in thicker CP films and the nature of the resulting changes in mechanical, electronic, and electrochemical properties of the CP film.
  • This paper reports on oxides grown electrochemically in a borate buffer solution on the surface of sputter-deposited AlCr alloy films studies by x-ray absorption near edge structure (Xanes). The measurements were made in air immediately following polarization in solution. The oxides were also examined with x-ray photoelectron spectroscopy (XPS). The effects of alloy composition and thickness as well as applied potential were studied. Cr(VI) was found in the oxides if the applied potential was sufficiently high. The Cr(VI) was enriched at the interface with the electrolyte and the proportion of Cr(VI) in the oxide was higher for alloy films containingmore » more Cr. The Cr(VI) in the oxides could be reversibly reduced to CR(III) and reoxidized to Cr(VI) by subsequent potentiostatic treatments in solution.« less
  • An optoelectronic device and a method for fabricating the optoelectronic device includes a first electrode disposed on a substrate, an exposed surface of the first electrode having a root mean square roughness of at least 30 nm and a height variation of at least 200 nm, the first electrode being transparent. A conformal layer of a first organic semiconductor material is deposited onto the first electrode by organic vapor phase deposition, the first organic semiconductor material being a small molecule material. A layer of a second organic semiconductor material is deposited over the conformal layer. At least some of themore » layer of the second organic semiconductor material directly contacts the conformal layer. A second electrode is deposited over the layer of the second organic semiconductor material. The first organic semiconductor material is of a donor-type or an acceptor-type relative to the second organic semiconductor material, which is of the other material type.« less