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U.S. Department of Energy
Office of Scientific and Technical Information

Slicing of silicon into sheet material. Silicon sheet growth development for the large area silicon sheet task of the low cost silicon solar array project. Second quarterly report, March 22, 1976--June 20, 1976

Technical Report ·
DOI:https://doi.org/10.2172/7177574· OSTI ID:7177574
Slicing tests of silicon to show the dependence of cutting rate on operating conditions are complete. Cutting rate is linear with cutting force per blade and bladehead speed, and inversely proportional to kerf width (loss) and kerf length. The dimensionless parameter of cutting efficiency is a good measure of the performance of a multiblade slicing system. Low contact pressure between the blades and the silicon workpiece result in increased wafer accuracy and cutting efficiency. Blade wear seems to be stable for all slicing tests, and is slightly lower with low cutting pressure. (WDM)
Research Organization:
Varian Associates, Lexington, Mass. (USA). Lexington Vacuum Div.
OSTI ID:
7177574
Report Number(s):
ERDA/JPL/954374-76/2
Country of Publication:
United States
Language:
English