Magnetron sputtering source
Patent
·
OSTI ID:7167745
A magnetron sputtering source for sputtering coating substrates includes a high thermal conductivity electrically insulating ceramic and magnetically attached sputter target which can eliminate vacuum sealing and direct fluid cooling of the cathode assembly. The magnetron sputtering source design results in greater compactness, improved operating characteristics, greater versatility, and low fabrication cost. The design easily retrofits most sputtering apparatuses and provides for safe, easy, and cost effective target replacement, installation, and removal. 12 figs.
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Univ. of California, Oakland, CA (United States)
- Patent Number(s):
- US 5333726; A
- Application Number:
- PPN: US 8-005122
- OSTI ID:
- 7167745
- Resource Relation:
- Patent File Date: 15 Jan 1993
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
CATHODE SPUTTERING
MATERIALS
PHYSICAL VAPOR DEPOSITION
DESIGN
ELECTRICAL INSULATORS
MAGNETRONS
TARGETS
DEPOSITION
ELECTRICAL EQUIPMENT
ELECTRON TUBES
ELECTRONIC EQUIPMENT
EQUIPMENT
MICROWAVE EQUIPMENT
MICROWAVE TUBES
SPUTTERING
SURFACE COATING
360101* - Metals & Alloys- Preparation & Fabrication
360201 - Ceramics
Cermets
& Refractories- Preparation & Fabrication
360601 - Other Materials- Preparation & Manufacture
CATHODE SPUTTERING
MATERIALS
PHYSICAL VAPOR DEPOSITION
DESIGN
ELECTRICAL INSULATORS
MAGNETRONS
TARGETS
DEPOSITION
ELECTRICAL EQUIPMENT
ELECTRON TUBES
ELECTRONIC EQUIPMENT
EQUIPMENT
MICROWAVE EQUIPMENT
MICROWAVE TUBES
SPUTTERING
SURFACE COATING
360101* - Metals & Alloys- Preparation & Fabrication
360201 - Ceramics
Cermets
& Refractories- Preparation & Fabrication
360601 - Other Materials- Preparation & Manufacture