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The role of boron in ductilizing Ni/sub 3/Al

Journal Article · · Metall. Trans., A; (United States)
OSTI ID:7161962
Ductilization of Ni/sub 3/Al at room temperature by microalloying with boron has been primarily attributed to the increased grain boundary cohesion in the presence of boron. However, another aspect of the role played by boron in ductilizing Ni/sub 3/Al is revealed when the Hall-Petch relationships for Ni/sub 3/Al and B-doped Ni/sub 3/Al are compared. A shallower slope for the B-doped Ni/sub 3/Al compared to that for Ni/sub 3/Al indicates a reduced resistance to slip propagation across grain boundaries, and therefore reduced stress concentration at boundaries, in the presence of boron. This comparison of Hall-Petch relationships was carried out by generating data for powder processed B-doped Ni/sub 3/Al at various grain sizes and by compiling data for Ni/sub 3/Al from the literature. In addition, the room temperature fracture of B-doped Ni/sub 3/Al has been shown to initiate along certain grain boundaries. The fracture eventually occurs by transgranular ductile tearing.
Research Organization:
Dept. of Metallurgy and Materials Science, Case Western Reserve Univ., Cleveland, OH (US)
OSTI ID:
7161962
Journal Information:
Metall. Trans., A; (United States), Journal Name: Metall. Trans., A; (United States) Vol. 18A:3; ISSN MTTAB
Country of Publication:
United States
Language:
English