Covalent nitrides for maskless laser writing of microscopic metal lines
Selected covalent metal nitrides with limited thermal stability, such as Sn[sub 3]N[sub 4], Cu[sub 3]N, and Ni[sub 3]N, were prepared in a glow discharge system by reactive sputtering in a nitrogen plasma. These compounds were characterized by chemical analysis and their thermal behavior established by temperature-programmed thermal decomposition. These materials decompose into the elements with the rate reaching a maximum at 615, 465, and 405[degrees]C for Sn, Cu, and Ni respectively. The feasibility of using these coatings to generate metal lines by maskless laser writing was explored. Conducting metal lines, a few micron in width, could be generated with each of these nitrides. The resistivities of the metal lines were within an order of magnitude of those of the bulk metals for Cu and Ni and somewhat more for Sn.
- Research Organization:
- Oak Ridge National Lab., TN (United States)
- Sponsoring Organization:
- USDOE; USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC05-84OR21400
- OSTI ID:
- 7138299
- Report Number(s):
- CONF-921101-11; ON: DE93004105
- Resource Relation:
- Conference: Material Research Society fall meeting, Boston, MA (United States), 30 Nov - 5 Dec 1992
- Country of Publication:
- United States
- Language:
- English
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Related Subjects
36 MATERIALS SCIENCE
COPPER
DEPOSITION
COPPER NITRIDES
SPUTTERING
INTEGRATED CIRCUITS
ELECTRIC CONTACTS
MICROELECTRONICS
NICKEL
NICKEL NITRIDES
SILICON NITRIDES
TIN
GLOW DISCHARGES
PYROLYSIS
CHEMICAL REACTIONS
COPPER COMPOUNDS
DECOMPOSITION
ELECTRIC DISCHARGES
ELECTRICAL EQUIPMENT
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
METALS
MICROELECTRONIC CIRCUITS
NICKEL COMPOUNDS
NITRIDES
NITROGEN COMPOUNDS
PNICTIDES
SILICON COMPOUNDS
THERMOCHEMICAL PROCESSES
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS
426000* - Engineering- Components
Electron Devices & Circuits- (1990-)
360201 - Ceramics
Cermets
& Refractories- Preparation & Fabrication