The morphological stability of lateral growth in solid-solid phase transformation during thin-film interdiffusion in Al/Cu bimetal films

Journal Article · Mon Aug 01 00:00:00 EDT 1994 · Metallurgical Transactions, A (Physical Metallurgy and Materials Science); (United States)

DOI:https://doi.org/10.1007/BF02668527· OSTI ID:7103254

McCarty, E D; Hackney, S A ^[1]

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1. Michigan Technological Univ., Houghton, MI (United States). Dept. of Metallurgical and Materials Engineering

This article describes the phenomenon of morphological instability in solid-solid phase transformations during thin-film interdiffusion, specifically related to the initial stages of precipitation when phase growth occurs along the interface between thin films. The experimental observations that revealed this effect will be presented, and a working hypothesis will be discussed. Experimental observation suggest that the ledge mechanism of growth is present in this system but does not inhibit the formation of interfacial instabilities. It is proposed that morphological stability for solid-phase growth occurring during thin-film interdiffusion can be treated by the inclusion of a solute-source term into the two-dimensional perturbation approach generally used to study unstable growth morphologies. Experimental observations that provide qualitative and semiquantitative support for the solute-source model are also presented.

• OSTI ID: 7103254
• Journal Information: Metallurgical Transactions, A (Physical Metallurgy and Materials Science); (United States), Vol. 25:8; ISSN 0360-2133
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM
INTERFACES
COMPOSITE MATERIALS
COPPER
PHASE TRANSFORMATIONS
CRYSTAL GROWTH
MATHEMATICAL MODELS
MICROSTRUCTURE
MORPHOLOGICAL CHANGES
MORPHOLOGY
ELEMENTS
MATERIALS
METALS
TRANSITION ELEMENTS
360602* - Other Materials- Structure & Phase Studies