Interfacial reaction of BN/Ni/sub 3/Al

Journal Article · Mon Oct 17 04:00:00 EDT 1988 · Appl. Phys. Lett.; (United States)

DOI:https://doi.org/10.1063/1.100467· OSTI ID:7090462

Chou, T C

Interfacial reaction between BN and Ni/sub 3/Al was studied by diffusion bonding at 1000 /sup 0/C. Error function type diffusion profiles of Ni and Al were observed. Al enrichment at the interface was detected. Kirkendall voids (Trans. Am. Inst. Min. Eng. 171, 130 (1947)) with faceted interfaces were observed in the interdiffusion zone of Ni/sub 3/Al side. In situ fractured interface showed a typical heterogeneous interfacial reaction. Three-dimensional Ni clusters were observed to grow into islands, and unevenly distributed in an alumina matrix of whisker form. The intriguing pattern of the outdiffusion and clustering of Ni atoms, as compared to Al, during the chemical interdiffusion between BN and Ni/sub 3/Al is discussed based upon grain boundary diffusion, diffusion environment, and thermodynamic driving force under oxygen environment.

• Research Organization: Research and Development, Engelhard Corporation, Edison, New Jersey 08818
• OSTI ID: 7090462
• Journal Information: Appl. Phys. Lett.; (United States), Journal Name: Appl. Phys. Lett.; (United States) Vol. 53:16; ISSN APPLA
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360204* -- Ceramics
Cermets
& Refractories-- Physical Properties
ALLOYS
ALUMINIUM
ALUMINIUM COMPOUNDS
ATOM TRANSPORT
BORON COMPOUNDS
BORON NITRIDES
CHEMICAL REACTIONS
DIFFUSION
ELEMENTS
INTERFACES
INTERMETALLIC COMPOUNDS
METALS
NEUTRAL-PARTICLE TRANSPORT
NICKEL
NICKEL COMPOUNDS
NITRIDES
NITROGEN COMPOUNDS
PNICTIDES
RADIATION TRANSPORT
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS
VERY HIGH TEMPERATURE