Structure and composition of thick tarnish films on alpha-phase copper alloys
Electron microprobe analysis, X-ray diffraction, and metallographic studies have been carried out on thick tarnish films formed on a series of alpha-phase Cu-Zn, Cu-Al, and Cu-Ni alloys by exposure to an ammoniacal solution. The results established that the tarnish films consist of an inner layer of Cu/sub 2/O and an outer layer of CuO, the latter being formed after long exposures. The microprobe data indicated that both oxides are essentially depleted with respect to the alloying elements, and appear to contain less copper than the stoichiometric values. These observations are consistent with the view that the Cu/sub 2/O is formed by a dissolution-reprecipitation mechanism; however, the mechanism of CuO formation is not yet understood.
- Research Organization:
- Univ. of Illinois, Urbana
- OSTI ID:
- 7087733
- Journal Information:
- Corrosion; (United States), Journal Name: Corrosion; (United States) Vol. 32:6; ISSN CORRA
- Country of Publication:
- United States
- Language:
- English
Similar Records
Electron microprobe study of the composition of tarnish films on copper-- zinc, copper--aluminum, and copper--nickel alloys
Rotating ring-disk electrode studies of Cu-Zn alloy electrodissolution in 1M HCl: Effect of benzotriazole
Related Subjects
360105* -- Metals & Alloys-- Corrosion & Erosion
ALLOYS
ALUMINIUM ALLOYS
AMMONIA
CHEMICAL ANALYSIS
CHEMICAL REACTIONS
COPPER ALLOYS
COPPER BASE ALLOYS
CORROSIVE EFFECTS
ELECTRON MICROPROBE ANALYSIS
HYDRIDES
HYDROGEN COMPOUNDS
MICROANALYSIS
NICKEL ALLOYS
NITROGEN COMPOUNDS
NITROGEN HYDRIDES
OXIDATION
ZINC ALLOYS