Modified thin film processing sequence

Technical Report · Sun Jun 01 04:00:00 EDT 1980

DOI:https://doi.org/10.2172/7061974· OSTI ID:7061974

Baxter, C. R.

A modified thin film processing sequence in which tantalum nitride (TA/sub 2/N) resistors are stabilized prior to chromium/gold (Cr/Au) evaporation was investigated, and the effects of subsequent processing on unstabilized Cr/Au films were determined. Thin films evaporated using the modified process yielded results similar to those of films evaporated using the standard processing techniques. Work on the modified process was discontinued because of some metallization adhesion failures at the Cr/Au-to-Ta/sub 2/N interface, higher contact resistance, and the additional steps required in processing.

• Research Organization: Bendix Corp., Kansas City, MO (USA)
• DOE Contract Number: AC04-76DP00613
• OSTI ID: 7061974
• Report Number(s): BDX-613-2409
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
CHROMIUM
DEPOSITION
ELECTRICAL EQUIPMENT
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
EVAPORATION
FABRICATION
FILMS
GOLD
METALS
MICROELECTRONIC CIRCUITS
NITRIDES
NITROGEN COMPOUNDS
PHASE TRANSFORMATIONS
PNICTIDES
RESISTORS
STABILIZATION
TANTALUM COMPOUNDS
TANTALUM NITRIDES
TRANSITION ELEMENT COMPOUNDS
TRANSITION ELEMENTS