Preparation of Ni-Sn alloys by an electroless-deposition method

Journal Article · Wed Jun 01 04:00:00 EDT 1994 · Journal of the Electrochemical Society; (United States)

DOI:https://doi.org/10.1149/1.2054948· OSTI ID:7007728

Shimauchi, Hidenori; Ozawa, Susumu; Tamura, Keiu; Osaka, Tetsuya ^[1]

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1. Waseda Univ., Tokyo (Japan). Dept. of Applied Chemistry

Ni-Sn alloy is expected for as a functional material, because of its excellent corrosion resistance, wear resistance, and solderability. Electroless-deposited Ni-Sn alloy films were investigated to increase tin content in the deposit. The maximum tin contents of electroless Ni-Sn-P and Ni-Sn-B were ca. 30 atom percent (a/o) and 42 a/o, respectively. The maximum tin contents in the case of Ni-Sn-B was nearly equal to that of electrodeposited Ni-Sn alloy already reported. The crystallinity of Ni-Sn-P and Ni-Sn-B alloys was raised up with an increase in tin content. The corrosion resistance of Ni-Sn-P and Ni-Sn-B alloys was between that of amorphous and crystalline electroless-deposited Ni-P. Codeposition of tin into Ni-P films improved solderability, but into the Ni-B films, the solderability of Ni-Sn-B films situated in the region between those of Ni-P and NiB, because the solderability of NiB is higher.

• OSTI ID: 7007728
• Journal Information: Journal of the Electrochemical Society; (United States), Journal Name: Journal of the Electrochemical Society; (United States) Vol. 141:6; ISSN 0013-4651; ISSN JESOAN
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360100* -- Metals & Alloys
ALLOYS
AMORPHOUS STATE
BORON ADDITIONS
BORON ALLOYS
CORROSION RESISTANCE
CRYSTAL STRUCTURE
DATA
DEPOSITION
EXPERIMENTAL DATA
FABRICATION
INFORMATION
JOINING
MORPHOLOGY
NICKEL ALLOYS
NUMERICAL DATA
PHOSPHORUS ADDITIONS
PLATING
SOLDERING
SURFACE COATING
TIN ALLOYS
WELDING