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Title: Resistivity and morphology of TiSi sub 2 formed on Xe sup + -implanted polycrystalline silicon

Journal Article · · Applied Physics Letters; (USA)
DOI:https://doi.org/10.1063/1.103295· OSTI ID:7004319
; ;  [1]
  1. Department of Materials Science and Engineering, Cornell University, Ithaca, New York 14853 (USA)

Xe ion irradiation of polycrystalline silicon before Ti deposition is found to affect subsequent silicide formation. Silicide films were prepared by implanting 60, 100, or 240 keV Xe{sup +} ions into 500-nm-thick undoped polycrystalline silicon before depositing Ti and annealing in vacuum. Preimplantation altered the subsequent silicide resistivity, x-ray diffraction patterns, and morphology as compared to films prepared on unimplanted polycrystalline Si substrates. We found that minimal TiSi{sub 2} resistivities were achieved at lower temperatures with preimplantation, indicating that the Xe-implanted substrate promotes a lower temperature transition from the metastable C49 phase to the low-resistivity equilibrium C54 phase of TiSi{sub 2}. X-ray diffraction results confirmed the lower temperature formation of the C54 phase with preimplantation. Low-temperature annealing (650 {degree}C, 30 min) of 6{times}10{sup 16} cm{sup {minus}2}, 240 keV Xe{sup +}-implanted samples yielded low-resistivity ({similar to}22 {mu}{Omega} cm) silicide films, while simultaneously annealed samples without preimplantation had resistivity five times higher. Lower doses were effective at lower implant energies, with low resistivity achieved after 725 {degree}C, 30 min annealing for 2{times}10{sup 15} cm{sup {minus}2}, 60 keV Xe{sup +} preimplantation.

OSTI ID:
7004319
Journal Information:
Applied Physics Letters; (USA), Vol. 56:5; ISSN 0003-6951
Country of Publication:
United States
Language:
English