Spreading and interlayer formation at the copper-copper oxides/polycrystalline alumina interface

Journal Article · Tue Nov 01 00:00:00 EST 1994 · Metallurgical Transactions, A (Physical Metallurgy and Materials Science); (United States)

DOI:https://doi.org/10.1007/BF02648869· OSTI ID:6996603

Baldwin, M D ^[1]; Chidambaram, P R; Edwards, G R ^[2]

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1. Sandia National Labs., Albuquerque, NM (United States). Liquid Metal Processing Lab.
2. Center for Welding and Joining Research, Golden, CO (United States). Dept. of Metallurgical and Materials Engineering

Spreadability and reaction layer growth rates of copper-oxygen alloys on polycrystalline alumina were measured above the melting point of copper to better understand the direct bonding process. Spreading was measured as a function of composition and temperature by monitoring the diameter of molten droplets as a function of time. As the oxygen content of the melt increased from 0 to 3 wt pct, the spreading diameter increased linearly, at fixed time and temperature. Constant diameters were observed for oxygen compositions between approximately 3 and 6 wt pct. The diameters again increased linearly for oxygen concentrations greater than 7 wt pct. This behavior was explained by reference to the copper-oxygen binary phase equilibrium. An interfacial product was identified to be the complex oxide, CuAlO[sub 2]. A detailed investigation of the interlayer growth kinetics was performed to understand the fundamental phenomena controlling the spreading rates. The growth rate of the CuAlO[sub 2] phase and the spreading rate were simultaneously measured for alumina in contact with a copper-2 wt pct oxygen alloy drop as a function of temperature. The reaction layer thickening was found to be diffusion controlled, with an apparent activation energy of 309 kJ/mol, and the spreading rate did not correlate with the thickening rate.

• DOE Contract Number: AC04-94AL85000
• OSTI ID: 6996603
• Journal Information: Metallurgical Transactions, A (Physical Metallurgy and Materials Science); (United States), Vol. 25:11; ISSN 0360-2133
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM OXIDES
BONDING
INTERFACES
COMPOSITE MATERIALS
COPPER ALLOYS
PHASE STUDIES
COPPER OXIDES
MICROSTRUCTURE
OXYGEN ADDITIONS
TEMPERATURE DEPENDENCE
WETTABILITY
ALLOYS
ALUMINIUM COMPOUNDS
CHALCOGENIDES
COPPER COMPOUNDS
FABRICATION
JOINING
MATERIALS
OXIDES
OXYGEN COMPOUNDS
TRANSITION ELEMENT COMPOUNDS
360601* - Other Materials- Preparation & Manufacture
360602 - Other Materials- Structure & Phase Studies