ECM (Environmentally Conscious Manufacturing) newsletter, August 1990

Technical Report · Wed Aug 01 00:00:00 EDT 1990

OSTI ID:6977695

This newsletter outlines efforts to develop alternate cleaning solutions to conventional CFC and CHC based solvents for the cleaning of electrical and mechanical assemblies. Material compatibility is a primary concern. Testing results with copper substrates and Pb-Sn eutectic solder are presented. A novel sensor for monitoring the organic concentrations in copper plating baths is also described. Measurements are made in real time and the probe is small enough to be placed in the bath without disturbing the plating process. Longer intervals between bath cleanup and extended bath lifetimes will result.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE; USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-76DP00789
• OSTI ID: 6977695
• Report Number(s): SAND-90-1375/1; ON: DE93009512
• Country of Publication: United States
• Language: English

Related Subjects

32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION
42 ENGINEERING
ELECTRONIC EQUIPMENT
CLEANING
SOLVENTS
MATERIAL SUBSTITUTION
COPPER
ELECTROPLATING
ENVIRONMENTAL IMPACTS
INDUSTRY
LEAD ALLOYS
MANUFACTURING
METALLURGICAL FLUX
MONITORS
SUBSTRATES
TIN ALLOYS
ALLOYS
DEPOSITION
ELECTRODEPOSITION
ELECTROLYSIS
ELEMENTS
EQUIPMENT
LYSIS
MEASURING INSTRUMENTS
METALS
PLATING
SURFACE COATING
TRANSITION ELEMENTS
320305* - Energy Conservation
Consumption
& Utilization- Industrial & Agricultural Processes- Industrial Waste Management
426000 - Engineering- Components
Electron Devices & Circuits- (1990-)