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Transport critical current density and microstructure in extruded YBa sub 2 Cu sub 3 O sub 7 minus x wires processed by zone melting

Journal Article · · Journal of Applied Physics; (USA)
DOI:https://doi.org/10.1063/1.347122· OSTI ID:6974174
; ; ;  [1]; ;  [2];  [3];  [4];  [5];  [6]
  1. Materials Science Division, Argonne National Laboratory, Argonne, Illinois 60439 (USA)
  2. Materials Science and Engineering Department, University of Notre Dame, Notre Dame, Indiana 46556 (USA)
  3. Materials Science Division, Argonne National Laboratory, Argonne, Illinois 60439 (USA) Georgia Institute of Technology, School of Physics, Atlanta, Georgia 30322 (USA)
  4. Materials Science Division, Argonne National Laboratory, Argonne, Illinois 60439 (USA) Department of Materials Science and Engineering, University of Illinois-Urbana, Urbana, Illinois 61801 (USA)
  5. Department of Physics, Western Illinois University, Macomb, Illinois 61455 (USA) Science and Technology Center for Superconductivity, Argonne National Laboratory, Argonne, Illinois 60439 (USA)
  6. Materials Science Division, Argonne National Laboratory, Argonne, Illinois 60439 (USA) Science and Technology Center
YBa{sub 2}Cu{sub 3}O{sub 7{minus}{ital x}} compounds were extruded into long wires with the diameter of 1 mm after sintering. The sintered wires were subsequently zone melted to develop a highly textured microstructure. Magnetization experiments at 77 K indicated a {ital J}{sub {ital c}} value of 1{times}10{sup 5} A/cm{sup 2} at 1 T. Transport measurements at 77 K showed a greatly enhanced field dependence of the critical current density. Transmission electron microscopy revealed an important grain-boundary feature which eliminated the weak-link behavior. Large amounts of dislocations have also been found in the zone-melted sample which may contribute to flux pinning in the system.
DOE Contract Number:
W-31109-ENG-38
OSTI ID:
6974174
Journal Information:
Journal of Applied Physics; (USA), Journal Name: Journal of Applied Physics; (USA) Vol. 68:1; ISSN 0021-8979; ISSN JAPIA
Country of Publication:
United States
Language:
English