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Dynamics of a planar magnetron discharge

Thesis/Dissertation ·
OSTI ID:6939521
In planar magnetron sputter deposition, metal atoms are sputtered from a source by a magnetically confined plasma. The sputtered atoms come to rest on substrates placed in the vacuum chamber, coating them with a thin metal film. This work employs modelling and experimental techniques to investigate the physical mechanisms which govern the operation of a planar magnetron discharge. The primary investigation centers on distribution of discharge current at the cathode. The cylindrically symmetric experimental system consists of a 12-inch diameter aluminum vacuum chamber with movable 9-inch diameter copper electrodes. Energy gained in the cathode sheath by secondary electrons emitted from the cathode goes into the ionization necessary for discharge maintenance. By examining the range of motion of these electrons in the magnetic field, the location of the plasma and thus the distribution of current at the cathode can be calculated. Such a calculation was carried out for the following scenarios: (1) the sheath is thin compared to the range of the electrons and electron motion is hamiltonian, (2) the sheath is thin and electron motion is dominated by diffusion, and (3) the sheath is thick compared to the range of the electrons and electron motion is hamiltonian. Only the latter, thick sheath model, gives good agreement with experimentally observed scaling.
Research Organization:
California Univ., Berkeley, CA (USA)
OSTI ID:
6939521
Country of Publication:
United States
Language:
English