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Band bending at Al, In, Ag, and Pt interfaces with CdTe and ZnTe (110)

Journal Article · · Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (USA)
DOI:https://doi.org/10.1116/1.576784· OSTI ID:6901506
; ; ; ; ;  [1]
  1. Stanford Electronics Laboratories, Stanford University, Stanford, CA (USA)

Band bending behavior and interfacial chemistry for Al, In, Ag, and Pt overlayers on vacuum-cleaved {ital p}-CdTe and {ital p}-ZnTe (110) have been studied using ultraviolet photoelectron spectroscopy (UPS) and x-ray photoelectron spectroscopy (XPS). These metals provide a range of metal--substrate reactivities: Al reacts strongly with Te, Ag moderately, and In minimally, with no evidence seen for In reaction on ZnTe. Pt exhibits strong alloying behavior with both Cd and Zn. All four metals are found to yield Schottky barriers on CdTe and ZnTe, with a narrow range of final Fermi level positions, {ital E}{sub {ital fi}}={ital E}{sub {ital f}}{minus}{ital E}{sub VBM}, observed on CdTe, from 0.9 to 1.05{plus minus}0.1 eV, and on ZnTe from 0.65 to 1.0{plus minus}0.1 eV. The prediction of the MIGS model that a difference in barrier height exists for two semiconductors dependent upon their band lineup (valence band offset) is examined and found to agree with experiment for Ag, Pt, and Al, but not for In. For the highly reactive Al, no evidence for the overlayer metallicity required for metal-induced gap states (MIGS) to operate is seen on CdTe or ZnTe until after band bending has stabilized. Reaction and intermixing for Al, Ag, and Pt overlayers on CdTe and ZnTe indicate these interfaces are not ideal. The possible role of defects at these four metal/CdTe and metal/ZnTe interfaces is considered, and provides a consistent explanation for the final Fermi level positions observed.

DOE Contract Number:
AC03-82ER13000
OSTI ID:
6901506
Journal Information:
Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (USA), Journal Name: Journal of Vacuum Science and Technology, A (Vacuum, Surfaces and Films); (USA) Vol. 8:3; ISSN JVTAD; ISSN 0734-2101
Country of Publication:
United States
Language:
English

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