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High temperature adhesives for binding Kapton

Conference · · Sci. Adv. Mater. Process Eng. Proc.; (United States)
OSTI ID:6899439
; ;
Experimental polyimide resins have been developed and evaluated as potential high temperature adhesives for bonding Kapton polyimide film. Lap shear strengths of Kapton/Kapton bonds were obtained as a function of test temperature, adherend thickness, and long term aging at 575K (575 F) in vacuum. Glass transition temperatures of the polyimide/Kapton bondlines were monitored by thermomechanical analysis.
Research Organization:
NASA Langley Research Center, Hampton, VA
OSTI ID:
6899439
Report Number(s):
CONF-780502-
Conference Information:
Journal Name: Sci. Adv. Mater. Process Eng. Proc.; (United States) Journal Volume: 23
Country of Publication:
United States
Language:
English

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Related Subjects

36 MATERIALS SCIENCE
360401* -- Polymers & Plastics-- Preparation & Fabrication-- (-1987)
ADHESIVES
ALLOYS
BONDING
ELEMENTS
EVALUATION
FABRICATION
FILMS
JOINING
JOINTS
LAP WELDS
MECHANICAL PROPERTIES
METALS
ORGANIC COMPOUNDS
ORGANIC POLYMERS
PETROCHEMICALS
PETROLEUM PRODUCTS
POLYMERS
REFRACTORY METALS
RESINS
SHEAR PROPERTIES
WELDED JOINTS