Residual stress anisotropy, stress control, and resistivity in post cathode magnetron sputter deposited molybdenum films

Journal Article · Thu Sep 01 00:00:00 EDT 1988 · J. Vac. Sci. Technol., A; (United States)

DOI:https://doi.org/10.1116/1.575451· OSTI ID:6881513

Cuthrell, R E; Mattox, D M; Peeples, C R; Dreike, P L; Lamppa, K P

As part of the program to develop a large-area thin-film pulse heater for a lithium ion source, the residual stress in post cathode magnetron sputter deposited molybdenum films has been studied. It was found that in films prepared in the low-pressure sputtering regime, the residual film stress is very sensitive to the gas pressure during sputtering and that the film stresses are highly anisotropic. The transition pressure for changing from compressive to tensile residual stress, as defined by Thornton and Hoffman, depends on the relationship between the measurement direction in the film and the post cathode orientation. In order to deposit a nearly stress-free film a pressure cycling technique was developed which deposited alternate film layers containing tensile and compressive stresses. Film resistivity and thermal coefficient of resistivity measurements were made during the pulse heating of the molybdenum films.

• Research Organization: Sandia National Laboratories, Albuquerque, New Mexico 87185
• OSTI ID: 6881513
• Journal Information: J. Vac. Sci. Technol., A; (United States), Vol. 6:5
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
MOLYBDENUM
ELECTRIC CONDUCTIVITY
SPUTTERING
STRESSES
CATHODES
EXPERIMENTAL DATA
MAGNETRONS
THIN FILMS
DATA
ELECTRICAL PROPERTIES
ELECTRODES
ELECTRON TUBES
ELECTRONIC EQUIPMENT
ELEMENTS
EQUIPMENT
FILMS
INFORMATION
METALS
MICROWAVE EQUIPMENT
MICROWAVE TUBES
NUMERICAL DATA
PHYSICAL PROPERTIES
TRANSITION ELEMENTS
360104* - Metals & Alloys- Physical Properties
360101 - Metals & Alloys- Preparation & Fabrication