Vickers hardness from plastic energy. [SILICON WAFER]

Journal Article · Wed Feb 15 04:00:00 EST 1995 · Scripta Metallurgica et Materialia; (United States)

DOI:https://doi.org/10.1016/0956-716X(95)90847-D· OSTI ID:6874589

Berriche, R ^[1]

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1. National Research Council of Canada, Ottawa, Ontario (Canada). Structures, Materials and Propulsion Lab.

Depth sensing indentation was performed on a single crystal silicon wafer with <100> orientation. The Vickers hardness was calculated using a new method that used the plastic work and the plastic depth and another method (the load method) that used the equation in the ASTM Standard E384, modified to accept the depth of penetration in place of the diagonal. The load method gave values much higher than published values while the plastic work method gave values in good agreement with published values.

• OSTI ID: 6874589
• Journal Information: Scripta Metallurgica et Materialia; (United States), Journal Name: Scripta Metallurgica et Materialia; (United States) Vol. 32:4; ISSN 0956-716X; ISSN SCRMEX
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
360103* -- Metals &amp; Alloys-- Mechanical Properties
COATINGS
CRYSTALS
DATA
DATA ANALYSIS
ELEMENTS
EXPERIMENTAL DATA
FILMS
INFORMATION
MATERIALS TESTING
MECHANICAL PROPERTIES
MECHANICAL TESTS
MONOCRYSTALS
NUMERICAL DATA
SEMIMETALS
SILICON
TESTING
THIN FILMS
VICKERS HARDNESS