Kinetic aspects of the grain boundary segregation in Cu(Bi) alloys

Journal Article · Tue Aug 10 00:00:00 EDT 1999 · Acta Materialia

DOI:https://doi.org/10.1016/S1359-6454(99)00168-8· OSTI ID:684395

Chang, L S; Hofmann, S; Gust, W ^[1]; Rabkin, E ^[2]

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1. Max-Planck-Inst fuer Metallforschung, Stuttgart (Germany)
2. Technion-Israel Inst. of Tech., Haifa (Israel). Dept. of Materials Engineering

The kinetics of grain boundary segregation in Cu(Bi) alloys has been studied at temperatures of 600 and 850 C by Auger electron spectroscopy. A substantial acceleration of the grain boundary segregation kinetics in the two-phase area of the Cu-Bi phase diagram is observed. To explain this acceleration, a model of dislocation diffusion is proposed. In the framework of the model, the accelerated kinetics of grain boundary segregation in the two-phase area of the Cu-Bi phase diagram results from the microscopic pipe-like precipitation of a Bi-rich liquid phase along the dislocation cores. The dislocation diffusivities are estimated and two kinds of diagrams of the segregation kinetics are constructed.

• OSTI ID: 684395
• Journal Information: Acta Materialia, Vol. 47, Issue 10; Other Information: PBD: 10 Aug 1999
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
GRAIN BOUNDARIES
COPPER ALLOYS
BISMUTH ALLOYS
SEGREGATION
KINETICS
TEMPERATURE DEPENDENCE
DIFFUSION
DISLOCATIONS
AUGER ELECTRON SPECTROSCOPY