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Title: Kinetic aspects of the grain boundary segregation in Cu(Bi) alloys

Abstract

The kinetics of grain boundary segregation in Cu(Bi) alloys has been studied at temperatures of 600 and 850 C by Auger electron spectroscopy. A substantial acceleration of the grain boundary segregation kinetics in the two-phase area of the Cu-Bi phase diagram is observed. To explain this acceleration, a model of dislocation diffusion is proposed. In the framework of the model, the accelerated kinetics of grain boundary segregation in the two-phase area of the Cu-Bi phase diagram results from the microscopic pipe-like precipitation of a Bi-rich liquid phase along the dislocation cores. The dislocation diffusivities are estimated and two kinds of diagrams of the segregation kinetics are constructed.

Authors:
; ;  [1];  [2]
  1. Max-Planck-Inst fuer Metallforschung, Stuttgart (Germany)
  2. Technion-Israel Inst. of Tech., Haifa (Israel). Dept. of Materials Engineering
Publication Date:
OSTI Identifier:
684395
Resource Type:
Journal Article
Journal Name:
Acta Materialia
Additional Journal Information:
Journal Volume: 47; Journal Issue: 10; Other Information: PBD: 10 Aug 1999
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; GRAIN BOUNDARIES; COPPER ALLOYS; BISMUTH ALLOYS; SEGREGATION; KINETICS; TEMPERATURE DEPENDENCE; DIFFUSION; DISLOCATIONS; AUGER ELECTRON SPECTROSCOPY

Citation Formats

Chang, L.S., Hofmann, S., Gust, W., and Rabkin, E. Kinetic aspects of the grain boundary segregation in Cu(Bi) alloys. United States: N. p., 1999. Web. doi:10.1016/S1359-6454(99)00168-8.
Chang, L.S., Hofmann, S., Gust, W., & Rabkin, E. Kinetic aspects of the grain boundary segregation in Cu(Bi) alloys. United States. doi:10.1016/S1359-6454(99)00168-8.
Chang, L.S., Hofmann, S., Gust, W., and Rabkin, E. Tue . "Kinetic aspects of the grain boundary segregation in Cu(Bi) alloys". United States. doi:10.1016/S1359-6454(99)00168-8.
@article{osti_684395,
title = {Kinetic aspects of the grain boundary segregation in Cu(Bi) alloys},
author = {Chang, L.S. and Hofmann, S. and Gust, W. and Rabkin, E.},
abstractNote = {The kinetics of grain boundary segregation in Cu(Bi) alloys has been studied at temperatures of 600 and 850 C by Auger electron spectroscopy. A substantial acceleration of the grain boundary segregation kinetics in the two-phase area of the Cu-Bi phase diagram is observed. To explain this acceleration, a model of dislocation diffusion is proposed. In the framework of the model, the accelerated kinetics of grain boundary segregation in the two-phase area of the Cu-Bi phase diagram results from the microscopic pipe-like precipitation of a Bi-rich liquid phase along the dislocation cores. The dislocation diffusivities are estimated and two kinds of diagrams of the segregation kinetics are constructed.},
doi = {10.1016/S1359-6454(99)00168-8},
journal = {Acta Materialia},
number = 10,
volume = 47,
place = {United States},
year = {1999},
month = {8}
}