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Substrate composition effects on the interfacial fracture of tantalum nitride films

Journal Article · · Journal of Materials Research
;  [1];  [2]
  1. Sandia National Laboratories, Livermore, California 94551-0969 (United States)
  2. University of Minnesota, Minneapolis, Minnesota 55455 (United States); Motorola, Tempe, Arizona (United States)
In this study we combined nanoscratch testing with a multilayer sapphire and aluminum nitride single-substrate system to determine the effects of interface composition and structure on susceptibility to fracture of hard, thin tantalum nitride films. Nanoindentation tests showed that the elastic moduli of the tantalum nitride and aluminum nitride films, as well as the sapphire substrate, were essentially equal at 400 GPa. On both portions of the substrate, these tests also showed that near surface hardness was near 35 GPa. Nanoscratch tests triggered long blisters and circular spalls on both the sapphire and aluminum nitride portions of the substrate. The blisters showed that the tantalum nitride film was subjected to a compressive residual stress of {minus}6.7 GPa. The spalls showed that failure occurred along the tantalum nitride film-substrate interface regardless of substrate composition. Most importantly, the blisters and spalls showed that the mode I component of the fracture energies were essentially equal on both substrate materials at a value near 3.1 J/m{sup 2}. These energies are on the order of the energies for metallic bonding. {copyright} {ital 1999 Materials Research Society.}
Research Organization:
Sandia National Laboratory
DOE Contract Number:
AC04-94AL85000; FG02-96ER45574
OSTI ID:
678835
Journal Information:
Journal of Materials Research, Journal Name: Journal of Materials Research Journal Issue: 6 Vol. 14; ISSN JMREEE; ISSN 0884-2914
Country of Publication:
United States
Language:
English