Package for integrated optic circuit and method
A structure and method are disclosed for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package. 6 figs.
- Research Organization:
- Sandia Corporation
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- SNL; SN: 98002026903; PA: EDB-98:120789; SCA: 426000
- Patent Number(s):
- US 5,790,730/A/
- Application Number:
- PAN: 8-336,902
- OSTI ID:
- 672725
- Country of Publication:
- United States
- Language:
- English
Similar Records
Multilayered microelectronic device package with an integral window
High-performance GaAs/AlGaAs optical modulators: Their performance and packaging for microwave photonic integrated circuits