Direct-write fabrication of integrated, multilayer ceramic components
The need for advanced (electronic) ceramic components with smaller size, greater functionality, and enhanced reliability requires the ability to integrate electronic ceramics in complex 3-D architectures. However, traditional tape casting and screen printing approaches are poorly suited to the requirements of rapid prototyping and small lot manufacturing. To address this need, the authors are developing a direct write approach for fabricating highly integrated, multilayer components using a micropen to deposit slurries in precise patterns. This approach provides the ability to fabricate multifunctional, multimaterial integrated ceramic components (MMICCs) in an agile and rapid way, and has been used to make integrated passive devices such RC filters, inductors, and voltage transformers.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 672003
- Report Number(s):
- SAND--98-0690C; CONF-980550--; ON: DE98003402; BR: DP0102031
- Country of Publication:
- United States
- Language:
- English
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