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Destructive testing of hybrid microcircuits containing thermocompression bonded devices and lead--indium soldered capacitors

Conference ·
OSTI ID:6545394
In-house hybrid microcircuits are manufactured at Bendix, Kansas City Division, for DOE weapons systems. Results of destructive testing of two development electronic systems on a new manufacturing program which contains thermocompression bonded devices and lead-indium soldered capacitors are reported. The destructive testing program was used to determine the reliability of the development assemblies and to develop base-line data for a destructive testing program for utilization during the production phase of the program.
Research Organization:
Bendix Corp., Kansas City, MO (USA)
DOE Contract Number:
EY-76-C-04-0613
OSTI ID:
6545394
Report Number(s):
BDX-613-2081; CONF-780914-2
Country of Publication:
United States
Language:
English

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Related Subjects

42 ENGINEERING
420500 -- Engineering-- Materials Testing
420800* -- Engineering-- Electronic Circuits & Devices-- (-1989)
CAPACITORS
DESTRUCTIVE TESTING
ELECTRICAL EQUIPMENT
ELECTRONIC CIRCUITS
ELEMENTS
EQUIPMENT
HYBRID SYSTEMS
INDIUM
LEAD
MATERIALS TESTING
METALS
MICROELECTRONIC CIRCUITS
TESTING